Semiconductor equipment giant Applied Materials announced on Monday that it plans to increase its stake in Dutch firm BE Semiconductor Industries (BESI) from 9% to approximately 20%. This strategic move marks a significant deepening of the partnership between the two companies, with a primary focus on advancing sophisticated chip-packaging technologies critical for artificial intelligence applications.

Reuters reported that Applied Materials, which has served as BESI’s largest shareholder since acquiring its initial 9% stake in April 2025, has entered into an accelerated share purchase agreement to secure the additional shares. This transaction is currently subject to a United States antitrust review. The expanded collaboration builds upon a working relationship that began in 2020, during which the two firms successfully cooperated on hybrid bonding technology—a crucial advanced packaging technique utilized in high-performance computing and modern AI semiconductors.

Despite boosting its financial investment, Applied Materials has clarified that it does not intend to increase its shareholding beyond the 20% threshold, nor does it plan to seek representation on BESI’s board of directors. By solidifying this partnership through increased financial backing without altering governance structures, both companies aim to accelerate the development of next-generation chip-connection and packaging solutions designed to meet the surging demands of the global artificial intelligence sector.